Introduction
IBM Research takes responsibility for technology and its role in society. Working in IBM Research means you’ll join a team who invent what’s next in computing, always choosing the big, urgent and mind-bending work that endures and shapes generations. Our passion for discovery, and excitement for defining the future of tech, is what builds our strong culture around solving problems for clients and seeing the real world impact that you can make.

IBM’s product and technology landscape includes Research, Software, and Infrastructure. Entering this domain positions you at the heart of IBM, where growth and innovation thrive.

Your Role and Responsibilities
This role will be responsible for multiple aspects of our IBM Research design and tape out activities which may include kerf/scribe development, and data processing scripts and algorithms for tape-out operations and logistics. In this role the individual will develop code to manipulate design layouts for optimized tape out and processing to improve process yield or printability in advanced technology research and development.

This role will develop and optimize reticle Frames (also referred to as Kerfs or Scribes) bordering internal test chip design using CAD software. In addition, this role may develop and optimize reticle Frames (also referred to as Kerfs or Scribes) bordering internal test chip design using CAD software. This role will collaborate closely across Technology Development, Patterning, Metrology, Photolithography, Process Integration, Data Preparation, Design Services and Mask Release for the specification and verification of design, frame structures and placement requirements. In addition, this role will develop and utilize automation for frame synthesis and associated documentation for use during wafer fabrication.

Developers and Engineers at IBM Research play a pivotal role in advancing innovation by overseeing the design, construction, testing, and characterization of both hardware and software. This multifaceted responsibility spans from individual devices to system-level implementations. Our team is dedicated to enabling and supporting internal research initiatives, evaluating emerging technologies for their potential application in real-world products, and demonstrating the value of these technologies for IBM’s businesses and strategic partners.

Required Technical and Professional Expertise

• Experience with Electrical Engineering, Computer Engineering, or equivalent background.
• Knowledge about the fundamental principles of semiconductor processing and/or semiconductor layout design.
• Experience with VLSI EDA tools such as Cadence Virtuoso, Synopsys ICVWB or similar tool, at least 3 years.
• At least 3 years of experience with software engineering automation and scripting (e.g., Python and/or shell scripting on a Linux platform).
• Basic understanding of physical layout, technology ground rules, and semiconductor processing.
• Ability to debug errors and solve problems in a team environment.
• Strong analytical skills, excellent written and verbal communication skills, and the ability to articulate difficult concepts to an audience with diverse technical backgrounds.

Preferred Technical and Professional Expertise

• Knowledge of Advanced semiconductor technology (14nm and below)
• At least 3 years of experience in semiconductor industry including working in a mask tapeout operations & logistics with knowledge of mask data preparation, in-line metrology, testchips, Optical Proximity Correction, mask data prep, reticle construction and manufacturing, and reticle frame building.
• At least 3 years of experience working with industry standard layout checking and manipulation tools such as from Cadence or Synopsys, including design rule checking (DRC).
• At least 3 years of experience in semiconductor design layout and electronic design automation, such as, knowledge of Cadence SKILL and pcell creation.
• Knowledge of Cadence MaskCompose or similar software package