Fabrication and Packaging Engineer

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Microsoft Quantum has assembled a talented and diverse international team to create the world’s first scalable quantum computing system. Our full-stack approach involves exciting innovation from quantum physics to providing global quantum services. The Microsoft Quantum program strives to fundamentally change the world of computing to help solve humankind’s problems that would otherwise take billions of years for today’s computers to solve! This has massive implications for research in healthcare, energy, environmental systems, smart materials, and more. We are accelerating our efforts in quantum computing and aim to bring a scalable quantum system to the broadest set of customers, empowering every person and organization on the planet to experience quantum computing. For more information about Azure Quantum and the Microsoft Quantum team, please visit https://quantum.microsoft.com/.

This role will support Microsoft’s first-party qubit development based on superconductor–semiconductor hybrid devices, focusing on the fabrication and packaging of quantum devices. The Fabrication and Packaging Engineer works at the interface between device design, process engineering, and integration with characterization and data science teams.

Required Qualifications

• Direct hands-on experience in semiconductor device packaging including wire bonding and die bonding.
• Solid experience working in cleanroom with processes such as photo- or ebeam- lithography, wet etching, deposition and related characterization equipment.
• Undergraduate or higher degree in engineering, materials science, physics, or related fields.
• Understanding of device physics, materials characterization, reliability testing, process documentation,
• Solid experience in workflow management and quality control in a fabrication environment.

Preferred Qualifications

• Master’s or higher degree in engineering, materials science, physics, or related fields.
• Experience with advanced packaging techniques for cryogenic quantum devices including heterogeneous and monolithic integration including flip chip packaging.
• Experience managing teams and interfacing with cross-functional groups (fabrication, packaging, characterization, data science).
• Significant direct hands-on experience in semiconductor device fabrication and packaging.
• Experience with equipment troubleshooting including hardware calibration and diagnostics.
• Experience with process automation, statistical process control, and yield improvement.
• Familiarity with AI-driven process optimization and data analysis.

#Quantum #QuantumCareers #MDQCareer

Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings: Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud background check upon hire/transfer and every two years thereafter.

• Participate in and provide technical leadership in the fabrication and packaging team to maintain and operate semiconductor device fabrication and packaging tools following standard protocols. Work closely with device design, characterization, and data science teams to deliver high-quality quantum devices for testing and integration. Main responsibilities include:
• Execute standardized and develop new fabrication and packaging protocols.
• Manage the fabrication and packaging team, equipment, and workflow.
• Daily monitoring of tools, processes, and cleanroom operations.
• Communicate results and share project reports with cross-functional teams.
• Manage process data with existing data infrastructure.
• Help generate long-term equipment plans and process scaling strategies.
• Model security and safety standards and practices, including compliance with policies, demonstrating good judgment in a variety of work environments.

• Embody Microsoft's Culture and Values